Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
- 期刊名称Applied Surface Science
- 作者Li, Jing; Liu, Yuhong; Wang, Tongqing; Lu, Xinchun; Luo, Jianbin
- 卷第265卷
- 印刷ISSN0169-4332
- 文件大小1401.75KB
- 发表时间2013-01
- DOI10.1016/j.apsusc.2012.11.106
- 页码764-770
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