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Overstress accommodation in notched woven-ply thermoplastic laminates at high-temperature: Numerical modeling and validation by Digital Image Correlation

Overstress accommodation in notched woven-ply thermoplastic laminates at high-temperature: Numerical modeling and validation by Digital Image Correlation

B. Vieille; J. Aucher; L. Taleb
  • 作者B. Vieille; J. Aucher; L. Taleb
  • 卷第45卷
  • 期第1期
  • 文件大小2954.75KB
  • 发表时间2013
  • DOI10.1016/j.compositesb.2012.06.015
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