Test Challenges for 3D Integrated Circuits
- 期刊名称IEEE Design & Test
- 作者Lee, Hsien-Hsin; Chakrabarty, Krishnendu
- 印刷ISSN2168-2356
- 电子ISSN2168-2364
- 文件大小354.37KB
- 发表时间2013
- DOI10.1109/MDT.2009.102
- 页码1-1
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