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Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder

Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder

M. L. Huang, Q. Zhou, N. Zhao, L. D. Chen

作者M. L. Huang, Q. Zhou, N. Zhao, L. D. Chen
卷第24卷
期第7期
文件大小900.71KB
发表时间2013-07
DOI10.1007/s10854-013-1143-0
页码2624-2629

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