Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects
Czerny, B.; Paul, I.; Khatibi, G.; Thoben, M.
- 期刊名称Microelectronics Reliability
- 作者Czerny, B.; Paul, I.; Khatibi, G.; Thoben, M.
- 卷第53卷
- 印刷ISSN0026-2714
- 文件大小1647.23KB
- 发表时间2013-9
- DOI10.1016/j.microrel.2013.07.090
- 页码1558-1562