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Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects

Czerny, B.; Paul, I.; Khatibi, G.; Thoben, M.
  • 期刊名称Microelectronics Reliability
  • 作者Czerny, B.; Paul, I.; Khatibi, G.; Thoben, M.
  • 卷第53卷
  • 印刷ISSN0026-2714
  • 文件大小1647.23KB
  • 发表时间2013-9
  • DOI10.1016/j.microrel.2013.07.090
  • 页码1558-1562
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