Integrating Physical and Digital Assemblies
- 期刊名称International Journal of Architectural Computing
- 作者Zarzycki, Andrzej
- 卷第11卷
- 期第2期
- 印刷ISSN1478-0771
- 文件大小4531.07KB
- 发表时间2013-06
- DOI10.1260/1478-0771.11.2.247
- 页码247-266
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Title page2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Front cover2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Copyright page2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Steering committee2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - ITC technical paper evaluation and selection process2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - TTTC: Test technology technical council2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Welcome messageRoberts, Gordon; Aitken, Rob · 2013
[IEEE 2013 IEEE International Test Conference (ITC) - Anaheim, CA, USA (2013.09.6-2013.09.13)] 2013 IEEE International Test Conference (ITC) - Table of contents2013