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Scaling of Copper Seed Layer Thickness Using Plasma-Enhanced ALD and Optimized Precursors

Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian

期刊名称IEEE Transactions on Semiconductor Manufacturing
作者Mao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian
卷第26卷
期第1期
印刷ISSN0894-6507
电子ISSN1558-2345
文件大小5826.06KB
发表时间2013-02
DOI10.1109/tsm.2012.2220789
页码17-22