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[IEEE 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum (IPDPSW) - Cambridge, MA, USA (2013.05.20-2013.05.24)] 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum - Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs

[IEEE 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum (IPDPSW) - Cambridge, MA, USA (2013.05.20-2013.05.24)] 2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum - Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs

Wold, Alexander; Koch, Dirk; Torresen, Jim

作者Wold, Alexander; Koch, Dirk; Torresen, Jim
文件大小226.39KB
发表时间2013
DOI10.1109/ipdpsw.2013.32
页码281-286

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