[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs

Lueck, M.; Malta, D.; Huffman, A.; Gregory, C.; Butler, M.; Lannon, J.; Temple, D. S.

作者Lueck, M.; Malta, D.; Huffman, A.; Gregory, C.; Butler, M.; Lannon, J.; Temple, D. S.
文件大小905.60KB
发表时间2013
DOI10.1109/ectc.2013.6575589
页码317-322

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