Development of Package-on-Package Using Embedded Wafer-Level Package Approach
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Chong, Ser Choong; Wee, David Ho Soon; Rao, Vempati Srinivasa; Vasarla, Nagendra Sekhar
- 卷第3卷
- 期第10期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小2017.15KB
- 发表时间2013-10
- DOI10.1109/tcpmt.2013.2275009
- 页码1654-1662
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