Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Nimura, Masatsugu; Mizuno, Jun; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shoji, Shuichi
- 卷第3卷
- 期第4期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小3429.97KB
- 发表时间2013-04
- DOI10.1109/tcpmt.2013.2240566
- 页码558-565
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