Wafer-Level Vacuum Packaging for Microsystems Using Glass Frit Bonding
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Wu, Guoqiang; Xu, Dehui; Sun, Xiao; Xiong, Bin; Wang, Yuelin
- 卷第3卷
- 期第10期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小3631.47KB
- 发表时间2013-10
- DOI10.1109/tcpmt.2013.2279135
- 页码1640-1646
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