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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Hybrid Au-Au bonding technology using planar adhesive structure for 3D integration

Nimura, Masatsugu; Mizuno, Jun; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shoji, Shuichi
  • 作者Nimura, Masatsugu; Mizuno, Jun; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shoji, Shuichi
  • 文件大小962.16KB
  • 发表时间2013
  • DOI10.1109/ectc.2013.6575719
  • 页码1153-1157
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