发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Buried parts simplify fine geometry electronic packaging, interconnect, & assembly

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Buried parts simplify fine geometry electronic packaging, interconnect, & assembly

Bauer, Charles E.; Neuhaus, Herbert J.
  • 作者Bauer, Charles E.; Neuhaus, Herbert J.
  • 文件大小601.80KB
  • 发表时间2013
  • DOI10.1109/icept.2013.6756559
  • 页码685-689
← 返回【学霸图书馆】主页