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Design and Modeling for 3D ICs and Interposers || Electrical Modeling of Through Silicon Vias

Design and Modeling for 3D ICs and Interposers || Electrical Modeling of Through Silicon Vias

Swaminathan, Madhavan; Han, Ki Jin

作者Swaminathan, Madhavan; Han, Ki Jin
文件大小3041.67KB
发表时间2013
DOI10.1142/9789814508605_0003
页码115-178

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