[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu
6
Sn
5
Intermetallic
Choudhury, Soud Farhan; Ladani, Leila
- 作者Choudhury, Soud Farhan; Ladani, Leila
- 文件大小1316.54KB
- 发表时间2013
- DOI10.1115/IPACK2013-73315