SAE Technical Paper Series [SAE International Asia Pacific Automotive Engineering Conference - (APR. 01, 2013)] SAE Technical Paper Series - Development of the Overmolding Instrument Panel
- 作者Byungseok, Kong
- 卷第1卷
- 印刷ISSNArra-y
- 文件大小5123.35KB
- 发表时间2013
- DOI10.4271/2013-01-0018
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