Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;C

TANISAWA, Hidekazu; TANISAWA, Hidekazu; TANIMOTO, Satoshi; TANIMOTO, Satoshi; WATANABE, Kinuyo; SATO, Shinji; SATO, Shinji; MATSUI, Kohei; MATSUI, Kohei; MURAKAMI, Yoshinori; MURAKAMI, Yoshinori; SASAKI, Kensuke; SASAKI, Kensuke

期刊名称Journal of Smart Processing
作者TANISAWA, Hidekazu; TANISAWA, Hidekazu; TANIMOTO, Satoshi; TANIMOTO, Satoshi; WATANABE, Kinuyo; SATO, Shinji; SATO, Shinji; MATSUI, Kohei; MATSUI, Kohei; MURAKAMI, Yoshinori; MURAKAMI, Yoshinori; SASAKI, Kensuke; SASAKI, Kensuke
卷第2卷
期第4期
印刷ISSN2186-702X
文件大小1505.33KB
发表时间2013
DOI10.7791/jspmee.2.152
页码152-159

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Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;C