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Copper deposition in microporous silicon using supercritical fluid

Jin, Lianhua; Oya, Toshifumi; Tamekuni, Shigeaki; Watanabe, Mitsuhiro; Kondoh, Eiichi; Gelloz, Bernard

期刊名称Thin Solid Films
作者Jin, Lianhua; Oya, Toshifumi; Tamekuni, Shigeaki; Watanabe, Mitsuhiro; Kondoh, Eiichi; Gelloz, Bernard
卷第567卷
印刷ISSN0040-6090
文件大小1030.44KB
发表时间2014-09
DOI10.1016/j.tsf.2014.07.042
页码82-86