Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs

• 期刊名称IEEE Microwave and Wireless Components Letters
• 作者Lu, Qijun; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue
• 卷第24卷
• 期第5期
• 印刷ISSN1531-1309
• 电子ISSN1558-1764
• 文件大小859.26KB
• 发表时间2014-5
• DOI10.1109/lmwc.2014.2309075
• 页码294-296