[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Process integration, improvements, and testing of Si interposers for embedded computing applications
Goodwin, S.; Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.
- 作者Goodwin, S.; Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.
- 文件大小2613.14KB
- 发表时间2014
- DOI10.1109/ectc.2014.6897259
- 页码8-12