[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Influences of material and structural factors on the stress conditions in Cu/low-k chips during Cu wire bonding

• 作者Bai, Xiaoyi; Chang, Baohua; Du, Dong
• 文件大小1210.62KB
• 发表时间2014
• DOI10.1109/icept.2014.6922692
• 页码441-446