In Situ Analysis of the Relationship between Cure Kinetics and the Mechanical Modulus of an Epoxy Resin

• 期刊名称Macromolecules
• 作者Aldridge, Michael; Wineman, Alan; Waas, Anthony; Kieffer, John
• 卷第47卷
• 期第23期
• 印刷ISSN0024-9297
• 电子ISSN1520-5835
• 文件大小1808.70KB
• 发表时间2014-12-09
• DOI10.1021/ma501441c
• 页码8368-8376