Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

• 期刊名称Journal of Electronic Packaging
• 作者Lau, John H.
• 卷第136卷
• 期第4期
• DOI210.0000/electronicpackaging.asmedigitalcollection.asme.org/generic-B50CB6A34BC7
• 印刷ISSN1043-7398
• 文件大小4522.13KB
• 发表时间2014-10-15
• DOI10.1115/1.4028629