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[IEEE 2014 11th International Symposium on Electronics and Telecommunications (ISETC) - Timisoara, Romania (2014.11.14-2014.11.15)] 2014 11th International Symposium on Electronics and Telecommunications (ISETC) - 3D self-heating electro-thermal model of multi-die IC

[IEEE 2014 11th International Symposium on Electronics and Telecommunications (ISETC) - Timisoara, Romania (2014.11.14-2014.11.15)] 2014 11th International Symposium on Electronics and Telecommunications (ISETC) - 3D self-heating electro-thermal model of multi-die IC

Nagy, Lukas; Stopjakova, Viera; Chvala, Ales
  • 作者Nagy, Lukas; Stopjakova, Viera; Chvala, Ales
  • 文件大小945.64KB
  • 发表时间2014
  • DOI10.1109/isetc.2014.7010738
  • 页码1-4
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