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Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES

Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES

Iyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat

作者Iyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat
文件大小2480.55KB
发表时间2014
DOI10.1142/9789814579797_0001
页码1-17

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