[IEEE 2014 IEEE 2nd International Conference on Emerging Electronics (ICEE) - Bengaluru, India (2014.12.3-2014.12.6)] 2014 IEEE 2nd International Conference on Emerging Electronics (ICEE) - An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices
- 作者Prabhu, Shreesha; Koyili, Sankaran; Manjunath, M. S.; Nayak, M. M.
- 文件大小240.80KB
- 发表时间2014
- DOI10.1109/icemelec.2014.7151206
- 页码1-4
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Elastic and inelastic scattering of neutral atoms by a corrugated hard wallG. Armand; J.R. Manson · 1979