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[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Analysis of wafer edge pressure distribution using intelligent pad in chemical mechanical polishing

[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Analysis of wafer edge pressure distribution using intelligent pad in chemical mechanical polishing

Lee, Changsuk; Park, Jaehong; Wang, Han; Jeong, Haedo

作者Lee, Changsuk; Park, Jaehong; Wang, Han; Jeong, Haedo
文件大小356.76KB
发表时间2014
DOI10.1109/icpt.2014.7017254
页码92-95

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