[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effect of the grain boundary on the dielectric breakdown strength of (Ba0.4Sr0.6)TiO3 paraelectric ceramics with various grain sizes
Song, Zhe; Liu, Hanxing; Hao, Hua; Cao, Minghe; Xu, Qing; Yao, Zhonghua; Wang, Zhijian; Hu, Wei; Shi, Yatong; Yu, Zhiyong
- 作者Song, Zhe; Liu, Hanxing; Hao, Hua; Cao, Minghe; Xu, Qing; Yao, Zhonghua; Wang, Zhijian; Hu, Wei; Shi, Yatong; Yu, Zhiyong
- 文件大小765.26KB
- 发表时间2014
- DOI10.1109/icept.2014.6918760
- 页码1-4