Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
- 期刊名称Journal of the Japan Institute of Metals and Materials
- 作者Fujiwara, Shinichi; Dauskardt, Reinhold H.
- 卷第78卷
- 期第5期
- 印刷ISSN0021-4876
- 电子ISSN1880-6880
- 文件大小6243.59KB
- 发表时间2014
- DOI10.2320/jinstmet.j2013075
- 页码177-182