[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Warpage measurements of printed circuit board during reflow process using strain gauges
- 作者Liao, M. C.; Huang, P. S.; Lin, Y. H.; Huang, C. Y; Tsai, M. Y.; Huang, T. C.
- 文件大小2134.30KB
- 发表时间2014
- DOI10.1109/IMPACT.2014.7048436
- 页码397-400
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