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Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || DYNAMIC THERMAL MANAGEMENT CONSIDERING ACCURATE TEMPERATURE-LEAKAGE INTERDEPENDENCY

Cooling of Microelectronic and Nanoelectronic Equipment (Advances and Emerging Research) || DYNAMIC THERMAL MANAGEMENT CONSIDERING ACCURATE TEMPERATURE-LEAKAGE INTERDEPENDENCY

Iyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat
  • 作者Iyengar, Madhusudan; Geisler, Karl J L; Sammakia, Bahgat
  • 文件大小326.43KB
  • 发表时间2014
  • DOI10.1142/9789814579797_0003
  • 页码43-67
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