Development and Application of Molded Interconnect Devices
- 期刊名称International Journal of Robotics Applications and Technologies
- 作者Cui, Liangyu; Yang, Chengjuan; Tian, Yanling; Zhang, Dawei
- 卷第2卷
- 期第1期
- 印刷ISSN2166-7195
- 电子ISSN2166-7209
- 文件大小5741.90KB
- 发表时间2014-01
- DOI10.4018/ijrat.2014010101
- 页码1-18
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