LSI-package Co-design Methodology for Thin Embedded-LSI Package Used as Bottom Package of Package-on-Package Structures
- 期刊名称Transactions of The Japan Institute of Electronics Packaging
- 作者Ohshima, Daisuke; Nakashima, Yoshiki; Kikuchi, Katsumi; Takemura, Koichi; Masu, Kazuya
- 卷第7卷
- 期第1期
- 印刷ISSN1883-3365
- 电子ISSN1884-8028
- 文件大小3994.23KB
- 发表时间2014
- DOI10.5104/jiepeng.7.104
- 页码104-113
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