Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy
Yang, Li; Zhang, Yaocheng; Dai, Jun; Jing, Yanfeng; Ge, Jinguo; Zhang, Ning
- 期刊名称Materials & Design
- 作者Yang, Li; Zhang, Yaocheng; Dai, Jun; Jing, Yanfeng; Ge, Jinguo; Zhang, Ning
- 卷第67卷
- 印刷ISSN0261-3069
- 文件大小4170.06KB
- 发表时间2015-02
- DOI10.1016/j.matdes.2014.11.036
- 页码209-216