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Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

Yang, Li; Zhang, Yaocheng; Dai, Jun; Jing, Yanfeng; Ge, Jinguo; Zhang, Ning
  • 期刊名称Materials & Design
  • 作者Yang, Li; Zhang, Yaocheng; Dai, Jun; Jing, Yanfeng; Ge, Jinguo; Zhang, Ning
  • 卷第67卷
  • 印刷ISSN0261-3069
  • 文件大小4170.06KB
  • 发表时间2015-02
  • DOI10.1016/j.matdes.2014.11.036
  • 页码209-216
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