Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

• 期刊名称Journal of Alloys and Compounds
• 作者Chen, Xu; Xue, Feng; Zhou, Jian; Yao, Yao
• 卷第633卷
• 印刷ISSN0925-8388
• 文件大小8135.17KB
• 发表时间2015-06
• DOI10.1016/j.jallcom.2015.01.219
• 页码377-383