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[IEEE 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Estoril, Portugal (2015.1.18-2015.1.22)] 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation

[IEEE 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Estoril, Portugal (2015.1.18-2015.1.22)] 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation

Forsberg, F.; Roxhed, N.; Colinge, C.; Stemme, G.; Niklaus, F.
  • 作者Forsberg, F.; Roxhed, N.; Colinge, C.; Stemme, G.; Niklaus, F.
  • 文件大小857.85KB
  • 发表时间2015
  • DOI10.1109/MEMSYS.2015.7050943
  • 页码280-283
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