[IEEE 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Estoril, Portugal (2015.1.18-2015.1.22)] 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) - Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique
- 作者Keshavarzi, Shervin; Mescheder, Ulrich; Reinecke, Holger
- 文件大小872.85KB
- 发表时间2015
- DOI10.1109/MEMSYS.2015.7050977
- 页码413-416
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