Efficient thin-film stack characterization using parametric sensitivity analysis for spectroscopic ellipsometry in semiconductor device fabrication

• 期刊名称Thin Solid Films
• 作者Likhachev, D.V.
• 卷第589卷
• 印刷ISSN0040-6090
• 文件大小732.54KB
• 发表时间2015-08
• DOI10.1016/j.tsf.2015.05.049
• 页码258-263