Laboratory assay of the effectiveness of the entomopathogenic fungus Isaria farinosa (Holmsk.) Fries (Sordariomycetes: Hypocreales) against the vine mealybug Planococcus ficus (Signoret) (Hemiptera: Pseudococcidae), even under the use of fungicides
- 期刊名称International Journal of Pest Management
- 作者Muştu, Murat; Demirci, Fikret; Kaydan, M. Bora; Ülgentürk, Selma
- 卷第61卷
- 期第3期
- 印刷ISSN0967-0874
- 电子ISSN1366-5863
- 文件大小176.07KB
- 发表时间2015-07-03
- DOI10.1080/09670874.2015.1047811
- 页码264-271
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 1 - A Model of Nanofluids Thermal ConductivityWang, Jinbo; Chen, Gang; Zhang, Zongqin · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Efficiency of a New Straight Cooling FinHanin, Leonid · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 1 - Phase Transition of Argon in a NanocavitySchoen, Philipp A. E.; Poulikakos, Dimos · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 2 - A Mechanistic Condensation Model for a Passive Condenser SystemOh, Seungmin; Revankar, Shripad T. · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 2 - A Model for Condensation Inside MinichannelsCavallini, Alberto; Del Col, Davide; Doretti, Luca; Matkovic, Marko; Rossetto, Luisa; Zilio, Claudio · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 2 - Unsteady Discharging of Wet Vapor From a VesselFridman, Ella; Dorfman, Abram · 2005
[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 3 - A New Computational Method for Free Surface ProblemsRice, Jeremy; Faghri, Amir · 2005
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - COZhang, Chong; Bet, Sachin; Salama, Islam A.; Quick, Nathaniel R.; Kar, Aravinda · 2005