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Using active thermography and modified SVM for intelligent diagnosis of solder bumps

Using active thermography and modified SVM for intelligent diagnosis of solder bumps

Wei, Wei; Wei, Li; Nie, Lei; Su, Lei; Lu, Xiangning

期刊名称Infrared Physics & Technology
作者Wei, Wei; Wei, Li; Nie, Lei; Su, Lei; Lu, Xiangning
卷第72卷
印刷ISSN1350-4495
文件大小2122.38KB
发表时间2015-09
DOI10.1016/j.infrared.2015.08.001
页码163-169

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