Thermal Comfort in High-rise Urban Environments in Singapore
- 期刊名称Procedia Engineering
- 作者Yang, Wei; Wong, Nyuk Hien; Lin, Yaolin
- 卷第121卷
- 印刷ISSN1877-7058
- 文件大小1004.57KB
- 发表时间2015
- DOI10.1016/j.proeng.2015.09.083
- 页码2125-2131
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