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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effects of rolling deformation on Al-27%Si alloys prepared by powder metallurgy for electronic packaging applications

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effects of rolling deformation on Al-27%Si alloys prepared by powder metallurgy for electronic packaging applications

Dai, Yilong; Yu, Kun; Teng, Fei; Xiong, Hanqing; Fan, Sufeng
  • 作者Dai, Yilong; Yu, Kun; Teng, Fei; Xiong, Hanqing; Fan, Sufeng
  • 文件大小1950.11KB
  • 发表时间2015
  • DOI10.1109/ICEPT.2015.7236605
  • 页码343-346
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