[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effects of rolling deformation on Al-27%Si alloys prepared by powder metallurgy for electronic packaging applications
Dai, Yilong; Yu, Kun; Teng, Fei; Xiong, Hanqing; Fan, Sufeng
- 作者Dai, Yilong; Yu, Kun; Teng, Fei; Xiong, Hanqing; Fan, Sufeng
- 文件大小1950.11KB
- 发表时间2015
- DOI10.1109/ICEPT.2015.7236605
- 页码343-346