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[IEEE 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Eger, Hungary (2015.5.6-2015.5.10)] 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Determination of BGA solder joint detachment cause - warpage effect

[IEEE 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Eger, Hungary (2015.5.6-2015.5.10)] 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Determination of BGA solder joint detachment cause - warpage effect

Busek, David; Dusek, Karel; Placek, Martin; Urbanek, Jan; Hornik, Jakub; Holec, Jan
  • 作者Busek, David; Dusek, Karel; Placek, Martin; Urbanek, Jan; Hornik, Jakub; Holec, Jan
  • 文件大小623.60KB
  • 发表时间2015
  • DOI10.1109/ISSE.2015.7248011
  • 页码306-309
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