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[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Cu via process optimization by electro-migration estimation testing

[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Cu via process optimization by electro-migration estimation testing

YiHeng Chen, ; Hui-Lan Sung, ; Shao-Jui Lo,

作者YiHeng Chen, ; Hui-Lan Sung, ; Shao-Jui Lo,
文件大小869.26KB
发表时间2015
DOI10.1109/ipfa.2015.7224330
页码48-51

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