[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Processing active devices on Si interposer and impact on cost

Velenis, D.; Detalle, M.; Hellings, G.; Scholz, M.; Marinissen, E.J.; Van der Plas, G.; La Manna, A.; Miller, A.; Linten, D.; Beyne, E.

作者Velenis, D.; Detalle, M.; Hellings, G.; Scholz, M.; Marinissen, E.J.; Van der Plas, G.; La Manna, A.; Miller, A.; Linten, D.; Beyne, E.
文件大小806.77KB
发表时间2015
DOI10.1109/3dic.2015.7334620

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