发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Thermal Stress Cleaving of Si-Wafer: Investigation of Fracture Initiation during Laser Beam Irradiation

Thermal Stress Cleaving of Si-Wafer: Investigation of Fracture Initiation during Laser Beam Irradiation

Saman, Alias Mohd; Furumoto, Tatsuaki; Hosokawa, Akira; Ueda, Takashi
  • 期刊名称Advanced Materials Research
  • 作者Saman, Alias Mohd; Furumoto, Tatsuaki; Hosokawa, Akira; Ueda, Takashi
  • 卷第1101卷
  • 电子ISSN1662-8985
  • 文件大小962.73KB
  • 发表时间2015-4
  • DOI10.4028/www.scientific.net/AMR.1101.412
  • 页码412-418
← 返回【学霸图书馆】主页