发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2015 IEEE 11th International Conference on ASIC (ASICON ) - Chengdu, China (2015.11.3-2015.11.6)] 2015 IEEE 11th International Conference on ASIC (ASICON) - A TSV alignment design for multilayer 3D IC

[IEEE 2015 IEEE 11th International Conference on ASIC (ASICON ) - Chengdu, China (2015.11.3-2015.11.6)] 2015 IEEE 11th International Conference on ASIC (ASICON) - A TSV alignment design for multilayer 3D IC

Zhao, Wei; Hou, Ligang; Peng, Xiaohong; Wang, Jinhui; Fu, Jingyan; Yang, Yang

作者Zhao, Wei; Hou, Ligang; Peng, Xiaohong; Wang, Jinhui; Fu, Jingyan; Yang, Yang
文件大小295.00KB
发表时间2015
DOI10.1109/asicon.2015.7517065
页码1-4

← 返回【学霸图书馆】主页