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Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Choudhury, Soud Farhan; Ladani, Leila
  • 期刊名称Journal of Electronic Packaging
  • 作者Choudhury, Soud Farhan; Ladani, Leila
  • 卷第137卷
  • 期第4期
  • 印刷ISSN1043-7398
  • 文件大小2167.18KB
  • 发表时间2015-09-25
  • DOI10.1115/1.4031523
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