发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Research on Delamination of Plastic Packaging Device during Reflow Soldering

Research on Delamination of Plastic Packaging Device during Reflow Soldering

Liu, Pei Sheng; Lu, Ying; Huang, Jin Xin; Yang, Long Long
  • 期刊名称Key Engineering Materials
  • 作者Liu, Pei Sheng; Lu, Ying; Huang, Jin Xin; Yang, Long Long
  • 电子ISSN1662-9795
  • 文件大小536.99KB
  • 发表时间2015-5
  • DOI10.4028/www.scientific.net/KEM.645-646.226
  • 页码226-231
← 返回【学霸图书馆】主页